Armando W. Colombo (Chair)
University of Applied Sciences Emden-Leer, Germany
E-Mail: armando_walter-colombo@t-online.deYang Shi (Vice Chair)
University of Victoria, Canada
E-Mail: yshi@uvic.caJose Lastra (Secretary)
Tampere University of Technology, Finland
E-Mail: jose.lastra@tut.fiMichael Basin
Autonomous University of Nuevo Leon, Mexico
E-Mail: mbasin@fcfm.uanl.mxCarlo Cecati
University of L'Aquila, Italy
E-Mail: carlo.cecati@univaq.itTianyou Chai
Northeast University, China
E-Mail: tychai@mail.neu.edu.cnElizabeth Chang
University of South Wales, Australia
E-Mail: elizabeth.chang@unsw.edu.auYuanye Chen
University of Victoria, Canada
E-Mail: yuanye@uvic.caMo-Yuen Chow
North Carolina State University, USA
E-Mail: chow@ncsu.eduMichael Condry
Intel, USA
E-Mail: michael.w.condry@intel.comJerker Delsing
Lulea Technical University, LTU, Sweden
E-Mail: jerker.delsing@ltu.seTharam Dillon
Latrobe University, Australia
E-Mail: tharam.dillon7@gmail.comFang Fang
North China Electric Power University, China
E-Mail: ffang@ncepu.edu.cnHuazhen Fang
University of Kansas, USA
E-Mail: fang@ku.eduHuijun Gao
Harbin Institute of Technology, China
E-Mail: huijungao@gmail.comZhiwei Gao
University of Glasgow, UK
E-Mail: zhiwei.gao@glasgow.ac.ukLuis Gomes
New University of Lisbon, Portugal
E-Mail: lugo@uninova.ptSong Guo
The University of Aizu, Japan
E-Mail: sguo@u-aizu.ac.jpGerhard Hancke
University of Hong Kong, China
E-Mail: gp.hancke@cityu.edu.hkHamid Reza Karimi
Politecnico di Milano, Italy
E-Mail: hamidreza.karimi@polimi.itStamatis Karnouskos
SAP, Germany
E-Mail: karnouskos@ieee.orgOkyay Kaynak
Bogazici University, Turkey and HIT, China
E-Mail: o.kaynak@ieee.orgHuiping Li
Northwestern Polytechnical University, China
E-Mail: lihuiping@nwpu.edu.cnMingxi Liu
University of Victoria, Canada
E-Mail: mxliu@uvic.caXue Liu
McGill University, Canada
E-Mail: xueliu@cs.mcgill.caRen Luo
National Taiwan University, Taiwan
E-Mail: renluo@ntu.edu.twMarga Marcos Munos
Escuela Superior de Ingenieria de Bilbao, Spain
E-Mail: marga.marcos@ehu.esJose Barata Oliveira
New University of Lisbon, Portugal
E-Mail: jab@uninova.ptCarlos Eduardo Pereira
University of Porto Alegre, Brasil
E-Mail: cpereira@eletro.ufrgs.brJiahu Qin
Chinese University of Science and Technology, China
E-Mail: jiahu.qin@gmail.comPeng Shi
University of Alelaide, Australia
E-Mail: peng.shi@adelaide.edu.auThomas Strasser
Austrian Institute of Technology, Austria
E-Mail: thomas.i.strasser@ieee.orgPavel Vrba
Czech Technical University in Prague, Czech
E-Mail: pavel.vrba@ciirc.cvut.czLong Wang
Peking University, China
E-Mail: longwang@mech.pku.edu.cnYong Xiang
Deakin University, Australia
E-Mail: yong.xiang@deakin.edu.auShen Yin
Harbin Institute of Technology, China
E-Mail: shen.yin@hit.edu.cnHui Zhang
Beihang University, China
E-Mail: huizhang285@gmail.comBirgit Vogel-Heuser
Technical University of Munich, Germany
E-Mail: vogel-heuser@ais.mw.tum.deAndrei Lobov
Tampere University of Technology, Finland
E-Mail: andrei.lobov@tut.fiAlexey Alexeevich Bobtsov
ITMO University, Russia
E-Mail: bobtsov@mail.ifmo.ruBorja Ramis Ferrer
Tampere University of Technology, Finland
E-Mail: borja.ramisferrer@tut.fiYevgeny I. Yablochnikov
ITMO University, Russia
E-Mail: eugeny@bee-pitron.spb.suJosé Barbosa
Polytechnic Institute of Bragança, Portugal
E-Mail: jbarbosa@ipb.ptJuho Maekioe
University of Applied Sciences Emden, Germany
E-Mail: juho.maekioe@technik-emden.deKamal Al-Haddad
École de technologie supérieure, Canada
E-Mail: kamal.al-haddad@etsmtl.caLucia Lo Bello
University of Catania, Italy
E-Mail: lobello@unict.itLuis Ribeiro
Linköping University
E-Mail: luis.ribeiro@liu.seMatthias Foehr
Siemens AG, Deutschland
E-Mail: matthias.foehr@siemens.comAnton Pyrkin
ITMO University, Russia
E-Mail: pyrkin@corp.ifmo.ruRodolfo E. Haber
Centre for Automation and Robotics (CSIC-UPM), Spain
E-Mail: rodolfo.haber@car.upm-csic.esTao Su
Huawei Technologies, China
E-Mail: sutao2@huawei.comThilo Sauter
Donabe University Krems, Austria
E-Mail: thilo.sauter@donau-uni.ac.atMichaelW. Condry
IEEE TEMS
E-Mail: condry@ieee.orgJan Haase
Helmut Schmidt University Hamburg, Germany
E-Mail: janhaase@ieee.orgStamatis Karnouskos
SAP, Germany
E-Mail: karnouskos@ieee.orgPaulo Leitão
Polytechnic Institute of Bragança, Portugal
E-Mail: pleitao@ieee.orgShangol Haider
IEEE
E-Mail: shangol.haider@ieee.orgVictor Huang
IEEE IES
E-Mail: v.huang@ieee.org